Medium Term indicators interpret price movement that happens over the last 50 days.Indicators in the Short Term group generally are used to interpret price movement that happens over the last 20 days.The table groups the 13 indicators based on Short, Medium, and Long Term time frames. This represents the average of the 13 popular indicators detailed in the table below. The Overall Average Signal, Strength and Direction is shown at the top of the page. Opinions are updated every 20 minutes throughout the day, using delayed data from the exchanges. Note: A security needs to have more than 200 active trading days in order to generate an Opinion reading for futures, the contract must have more than 100 active trading days. After each calculation, the program assigns a buy, sell or hold value for each study, depending on where the price lies in reference to the common interpretation of the study. For example, if the price is above the moving average of the security then this is generally considered an upward trend or a buy. The Opinions takes up to 5 years' worth of historical data and runs these prices through thirteen different technical indicators. A mean time to failure relationship of lead-free solder joints under pulsed current loading is proposed based on the experimental data.Barchart Opinions show traders what a variety of popular trading systems are suggesting in terms of going long or short the market. SEM image shows that damage develops at both current crowding corners and the skin layer of solder joints. Higher frequency leads to a shorter lifetime within the frequency range we studied. It was observed that Mean Time to Failure (MTTF) was inversely proportional to the current density and duty factor. The nominal current density varied from 1.0 × 10 5 A/cm 2 to 2.1 × 10 5 A/cm 2, PDC frequency ranged from 2 MHz to 10 MHz, and duty factor varied between 30% and 80% with a controlled ambient temperature at 70 ° C. During the test, frequency, current density and duty factors are used as controlling parameters. In this study, high frequency pulse current electromigration degradation experiments were carried out on Sn96.5%Ag3.0%Cu0.5 (SAC305-by weight) solder joints. As a consequence, immense information processing duties, high current density and large joule heating are exerted on the package, which makes electromigration and thermomigration a serious reliability issue. The insatiable demand for miniaturization of consumer electronics has brought continuing challenges in the electronic packaging field. In this work, we presented both the wafer level and package EM testing methodologies, and the rigorous data analysis that takes into account of the bimodal distribution of EM test data. Rigorous statistical analysis of EM test data is another key factor for this accurate assessment. The understanding of EM has also led to a better EM testing methodology in order to accurately assess the EM of an interconnection. This identification leads to various design and process modifications and inventions in order to face the challenges of high EM reliability for an ever shrinking interconnection. The extensive studies of EM lead to a much better understanding of the physics of EM, and with this understanding, the factors that affect the EM of interconnects, especially at the field operating conditions are identified and presented here. Both approaches are presented in this work. As a result, the conventional diffusion path approach for the modeling of EM is inadequate, and the driving force approach is needed. However, as the interconnect line width shrinks to submicrometer level, other driving forces become important and even dominating. ![]() ![]() Electron wind force was proposed to be the driving force for EM. In this work, the history and the evolution on the studies of EM are presented for both Al and Cu interconnection. ![]() The first reported work on electromigration (EM) was presented in 1959, and since then extensive studies on the EM are being conducted theoretically, experimentally and numerically.
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